UPES: Campus within Natural Boundaries

I think that curriculum is way ahead of many universities but it still face practicality issues. It is seen that curriculum is made by industry experts which has a proper combination of theory and numerical. The exams are held on time.

I must say to look for internship opportunities on yourself. Even if they provide multiple internship opportunities within campus but they are not very good for your learning. Only handful of known companies will be there on campus for hiring interns from UPES.

Placements are quite average and you should not expect much from this college. You should maintain your 8+ CGPA so that you can sit in placements. Even if any person is not placed they will provide you assistance even after completion of your degree but they will not guarantee it.

The fee structure goes semester wise and fee is to be submitted in advance of semester. Talking about scholarships, then there are many types of scholarships available with a strong financial support like domicile scholarship, merit scholarship etc. There are multiple opportunities which will open up to you in terms of employment opportunities but also not to expect much from them.

It is the best quality of this college there, are so many active clubs present throughout the college which will help you to have a connected social life. Quality of infrastructure is present to provide the finest results and there are variety of books present there to gain knowledge.

The application process is very simple and if I talk about me then I hadn't given any entrance exam for admission but there is an entrance exam present for admissions. The admission process is completely online and even if you visit the campus then also they will give you very well.

Most of the faculties use case studies to teach a theoretical subject but for numerical subjects they don't make us to do practice and also don't teach concepts in-depth. If we talk about practical application, then only few professors will be applying it in real world.